Intermetallic Compound Formation in Ti/Al Alloy Thin Film Couples and Its Role in Electromigration Lifetime
- 1 January 1994
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 141 (1) , 302-306
- https://doi.org/10.1149/1.2054705
Abstract
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