Stress-promoted interface diffusion as a precursor of fracture
- 1 November 1993
- journal article
- research article
- Published by AIP Publishing in The Journal of Chemical Physics
- Vol. 99 (9) , 6923-6934
- https://doi.org/10.1063/1.465836
Abstract
Stress‐modulated surfacemass transport offers a possible path to the ultimate fracture of brittle solids. A positive feedback between the local geometry, stress concentration, and chemical potential on a rough surface results in the formation of fracture precursor. Starting from general kinetic equations, we propose a reduced two‐parameter description of a growing concavity. A suggested interpolation enables us to obtain an ordinary differential equation describing the precursor evolution; it starts from a smooth boundary and under certain conditions generates a cusp singularity. This sharp notch becomes a stress concentrator and facilitates direct brittlefracture. The diffusion‐limited prefracture mechanism, though slow, circumvents a crack nucleation barrier and can be a determining factor for the durability of materials.Keywords
This publication has 23 references indexed in Scilit:
- Stress-induced failure and melting of ideal solidsThe Journal of Chemical Physics, 1993
- Effect of temperature and small-scale defects on the strength of solidsThe Journal of Chemical Physics, 1991
- On crack interaction and crack density in strain-induced cracking of brittle films on ductile substratesActa Metallurgica et Materialia, 1991
- Rate of microcrack nucleationPhysical Review A, 1991
- The molecular wedge in a brittle crack: A simulation of mica/waterJournal of Materials Research, 1990
- Nonclassical nucleation and growth of cohesive tensile cracksPhysical Review Letters, 1989
- Steady-state propagation of a crack in a viscoelastic stripPhysical Review A, 1989
- Self-organization of mineralization patterns in metamorphic rocks through mechanochemical couplingThe Journal of Physical Chemistry, 1989
- Transport of H through asymmetric metal layersPhysica Scripta, 1987
- Theory of Thermal GroovingJournal of Applied Physics, 1957