The physical basis of moisture transport in a cured epoxy resin system

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Abstract
The moisture transport characteristics of a difunctional epoxy resin cured with different amounts of metaphenylene diamine, using two cure cycles, are reported. Besides studying the kinetics of moisture sorption at 20, 50, 75, and 100°C, the investigations also included measurement of thermal expansion coefficients and dynamic mechanical transition of the dry and wet samples. The moisture sorption of the sample is shown to be related to its specific volume and hence to its fractional free volume. In the glassy state, the free volume is apparently in the form of frozen voids, and moisture sorption/desorption at this temperature is of the Langmuir type with little or no bond formation. At higher temperatures the free volume is generated predominantly through segmental motion of the α transition. The Henry's Law mode becomes operative, and the moisture can now form bonds. The possible effect of nonuniform crosslink density on moisture sorption is also considered.