Progress in and Technology of Low-Cost Silver Containing Thick-Film Conductors
- 1 December 1980
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 3 (4) , 504-517
- https://doi.org/10.1109/tchmt.1980.1135648
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Influence of metallic diffusion on the adhesion of screen printed silver filmsMetallurgical Transactions, 1970