Stress Corrosion Cracking of Pure Copper

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Abstract
It is known that the rate of tarnish film formation is an important factor in the stress corrosion cracking (SCC) of brass. Because copper immersed in cupric acetate and sulfate solutions has tarnish film growth rates comparable to those found for brasses susceptible to SCC, it should undergo cracking in such solutions if kinetics play a role. It was found that pure copper is susceptible to cracking in cupric acetate solution but not in cupric sulfate. Light, which retards film formation on copper, but not corrosion, prevents stress cracking in the cupric acetate solution. In the absence of stress, oxide forms all over the copper surface, while stress concentrates oxide formation at the grain boundaries. These experiments point to a brittle‐film rupture mechanism of stress cracking.
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