Nondestructive Bond Pull in High-Reliability Applications

• 1 September 1978
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
• Vol. 1  (3) , 228-236
• https://doi.org/10.1109/tchmt.1978.1135279

Abstract

Keywords

• ALUMINUM
• PROCESS PARAMETERS
• GOLD
• LIFE
• CAPILLARY TEMPERATURES
• BOND RELIABILITY