MCM and bare chip technology for a wide range of computers
- 23 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 05695503,p. 133-138
- https://doi.org/10.1109/ectc.1996.517384
Abstract
For a versatile MCM packaging technology with bare chip interconnection, an adequate patterned substrate and efficient cooling have been developed. A lineup of MCMs from a high-end supercomputer to a low-end portable PC are arranged by the combination of flip-chip and substrate technologies. More than thirty kinds of MCMs have been developed and are in production. These MCMs are classified into MCM-D and MCM-L, which are applied to both bare flip-chip devices of area bump and peripheral bump type. This effective combination of MCM technology for a wide range computers is discussed in this paper.Keywords
This publication has 1 reference indexed in Scilit:
- High performance MCM-D technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002