Packaging Technology for III-V Photonic Devices and Integrated Circuits
- 2 January 1989
- journal article
- website
- Published by Institute of Electrical and Electronics Engineers (IEEE) in AT&T Technical Journal
- Vol. 68 (1) , 83-92
- https://doi.org/10.1002/j.1538-7305.1989.tb00648.x
Abstract
Semiconductor device packages provide mechanical protection, an electrical interface between their chips and the outside world, a means of removing heat, and in the case of photonic devices, a means of coupling the photons to or from their detectors or source chips. Because III-V devices are often used for their optical properties or their high-frequency characteristics, or both, this paper focuses on optical and electrical interfaces rather than on the mechanical and thermal interfaces.Keywords
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