Single chip bumping and reliability for flip chip processes

• 1 September 1999
• journal article
• Published by Elsevier in Microelectronics Reliability
• Vol. 39  (9) , 1389-1397
• https://doi.org/10.1016/s0026-2714(99)00067-0

Abstract

Keywords

• FLIP CHIP
• SINGLE CHIP BUMPING
• RELIABILITY
• STUD BUMPING
• WEDGE BUMPING
• PALLADIUM