Direct chip interconnect with adhesive conductor films
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (6) , 972-976
- https://doi.org/10.1109/33.206919
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Direct chip interconnect using polymer bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Microelectronics Packaging HandbookPublished by Springer Nature ,1988
- Multichip Packaging Design for VLSI-Based SystemsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987