Factors contributing to the corrosion of the aluminum metal on semiconductor devices packaged in plastics
- 1 January 1976
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 15 (6) , 601-611
- https://doi.org/10.1016/0026-2714(76)90278-x
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Interaction Between Phosphosilicate Glass Films and WaterJournal of the Electrochemical Society, 1974
- The Effects of Epoxy Encapsulant Composition on Semiconductor Device StabilityJournal of the Electrochemical Society, 1971