Effect of Gold on the Reliability of Fine Pitch Surface Mount Solder Joints
- 1 March 1992
- journal article
- Published by Emerald Publishing in Circuit World
- Vol. 18 (4) , 41-46
- https://doi.org/10.1108/eb046177
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Solder joint reliability of fine pitch surface mount technology assembliesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Experimental and statistical analyses of surface-mount technology PLCC solder-joint reliabilityIEEE Transactions on Reliability, 1988
- Embrittlement of Solder by Gold from Plated SurfacesPublished by ASTM International ,1963