Preparation of the metastable interstitial copper nitride, Cu4N, by d.c. plasma ion nitriding
- 30 September 1989
- journal article
- research article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 117, L1-L3
- https://doi.org/10.1016/0921-5093(89)90110-x
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Preparation of the metastable interstitial copper nitride, Cu4N, by d.c. plasma ion nitridingMaterials Science and Engineering: A, 1989
- Mechanism of high-temperature plasma nitriding of titaniumMaterials Science and Engineering, 1988
- Thermochemical surface treatment of titanium and titanium alloy Ti6Al4V by low energy nitrogen ion bombardmentMaterials Science and Engineering, 1985
- Some Revisions of the Covalent Radii and the Additivity Rule for the Lengths of Partially Ionic Single Covalent Bonds*Journal of the American Chemical Society, 1941