A Multilayer Ceramic Multichip Module
- 1 December 1980
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 3 (4) , 634-637
- https://doi.org/10.1109/tchmt.1980.1135663
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969
- SLT Device Metallurgy and its Monolithic ExtensionIBM Journal of Research and Development, 1969