Self-annealing of electrochemically deposited copper films in advanced interconnect applications
- 27 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 166-168
- https://doi.org/10.1109/iitc.1998.704781
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Copper metallization for ULSL and beyondCritical Reviews in Solid State and Materials Sciences, 1995
- Comparative Cu Diffusion Studies in Advanced Metallizations of Cu and Al-Cu Based Thin FilmsMRS Proceedings, 1994
- Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. II. X-ray investigation of primary recrystallizationJournal of Applied Electrochemistry, 1985