Refractory Metal Encapsulation in Copper Wiring
- 1 January 1994
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Copper deposition and thermal stability issues in copper-based metallization for ULSI technologyMaterials Science Reports, 1992
- Thermally induced reactions of thin Ti and Nb films with SiO2 substratesJournal of Applied Physics, 1990
- Intermetallic compound formations in titanium-copper thin-film couplesJournal of Applied Physics, 1985