Attaining Low Moisture Levels in Hermetic Packages

• 1 March 1982
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• https://doi.org/10.1109/irps.1982.361938

Abstract

Keywords

• TIN
• MOISTURE
• WATER VAPOR
• GOLD
• MOISTURE CONTENT
• PACKAGING
• SILICON
• CHIP
• CERAMICS