The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solder
- 1 May 1987
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 16 (3) , 181-186
- https://doi.org/10.1007/bf02655484
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Observations on the Growth and Impact of Intermetallic Compounds on Tin‐Coated SubstratesCircuit World, 1983
- The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead AlloysTransactions of the IMF, 1976
- The influence of anisotropy and crystalline slip on relaxation at a crack tipActa Metallurgica, 1973
- On the Growth of Alloy Layer between Solid Copper and Liquid TinTransactions of the Japan Institute of Metals, 1972