Constitutive relations for tin-based solder joints
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (6) , 1013-1024
- https://doi.org/10.1109/33.206925
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
- Creep and tensile behavior of lead-rich, lead-tin solder alloysPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Fatigue analysis of flip chip assemblies using thermal stress simulations and a Coffin-Manson relationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Mechanical characteristics of 96.5 Sn/3.5 Ag solder in micro-bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Microstructure and Mechanical Properties of Solder AlloysPublished by Springer Nature ,1991
- The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder JointsPublished by Springer Nature ,1991
- Reliability of Soldered Joints: A Description of the State of the ArtSoldering & Surface Mount Technology, 1990
- The microstructural details of β-Sn precipitation in a 5Sn-95Pb solder alloyMetallurgical Transactions A, 1989
- Deformation Behavior of Leadless 60% Pb–40% Sn Solder JointsMRS Proceedings, 1987
- Deformation at High TemperaturesPublished by Elsevier ,1982
- Experimental constitutive relations for the high temperature deformation of a PbSn eutectic alloyMaterials Science and Engineering, 1981