Inclusion of conductivity in silicon s.a.w. component design

29 September 1977

journal article
Published by Institution of Engineering and Technology (IET) in Electronics Letters

Vol. 13 (20) , 594-596
https://doi.org/10.1049/el:19770428

Abstract

An equivalent circuit is described for a surface-acoustic-wave delay line utilising interdigital transducers in a multilayered medium with a conductive silicon substrate. Attention is paid to practical material parameters for the ultimate realisation of the monolithic integration of surface-acoustic-wave and electronic components on the same silicon slice.

Keywords

EQUIVALENT CIRCUIT
SI SAW COMPONENT DESIGN
MONOLITHIC INTEGRATION
SURFACE ACOUSTIC WAVE DELAY LINE
CONDUCTIVITY
MULTILAYERED MEDIUM
INTERDIGITAL TRANSDUCERS

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