An Overview of Materials Science in Printed Circuit Packaging

Publisher Website

1 January 1984

journal article
Published by Springer Nature in MRS Proceedings

Vol. 40
https://doi.org/10.1557/proc-40-21

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Moisture solubility and diffusion in epoxy and epoxy-glass composites
IBM Journal of Research and Development, 1984
The Effect of Drilling Temperature on Multilayer Board Hole Quality
Circuit World, 1977