The Evolution of Chem-Mechanical Planarization: From Aberrant to Prosaic
- 1 January 1994
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
Chem-Mechanical Planarization (CMP) is a rapidly growing technology in the semiconductor fabrication repertoire. Initially offering an answer to the need for truly global planarization brought about by optical steppers' ever decreasing Depth of Focus (DOF), CMP may come to stay more for its impressive ability to actually decrease defect density, as well as potentially reduce the contact resistance of Tungsten plugs. But even the use of CMP at this post-etchback step first requires a manufacturable oxide planarization CMP technology, the single most difficult challenge of all the different CMP applications. In this presentation, We will describe various remaining mysteries of some of the more fundamental questions involving the process in addition to some present manufacturing issues.Keywords
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