Development of under bump metallizations for flip chip bonding to organic substrates
- 1 November 1999
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1146-1149
- https://doi.org/10.1007/s11664-999-0149-0
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
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- Rate of consumption of Cu in soldering accompanied by ripeningApplied Physics Letters, 1995
- Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and CuApplied Physics Letters, 1995