Relaxation of local high temperatures due to shock compression as observed by the emf from a copper-Constantan junction
- 1 March 1981
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 52 (3) , 1590-1591
- https://doi.org/10.1063/1.329645
Abstract
The anomalous response of a copper-Constantan thermocouple to shock compression, where the junction consists of silver paste and includes a porous layer, is interpreted as being due to local heating and subsequent thermal relaxation by heat conduction. The thermal relaxation pattern, tentatively calculated using the diffusion equation, is consistent with the experimentally observed response.This publication has 4 references indexed in Scilit:
- Shock-Induced Electrical Responses of Copper-Constantan Junctions with SolderJapanese Journal of Applied Physics, 1980
- Accordion-type laser-Raman (ALR) oscillations in crystalline polymersJournal of Applied Physics, 1979
- Thermal relaxation at interfaces following shock compressionJournal of Applied Physics, 1974
- Temperature deposition caused by shock interactions with material interfacesJournal of Applied Physics, 1974