Development of a cost effective high performance metal QFP packaging system
- 30 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 405-411
- https://doi.org/10.1109/ectc.1993.346815
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Comparison of thermal enhancements to a commercial quad flatpackPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Thermal analysis of plastic QFP with high thermal dissipationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Thermal characterization of plastic and ceramic surface-mount componentsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988