Wettability of Liquid Tin on Solid Copper
- 1 January 1973
- journal article
- Published by Japan Institute of Metals in Transactions of the Japan Institute of Metals
- Vol. 14 (2) , 114-119
- https://doi.org/10.2320/matertrans1960.14.114
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- On the Growth of an Alloy Layer between Solid Copper and Liquid TinJournal of the Japan Institute of Metals and Materials, 1970
- On the Dissolution of Copper in Liquid TinJournal of the Japan Institute of Metals and Materials, 1967
- Study on the Soft Soldering (Report 1)JOURNAL OF THE JAPAN WELDING SOCIETY, 1960
- The Spreading of Liquid Metals on Solid Surfaces. Surface Chemistry of High-Energy Substances.Chemical Reviews, 1953