Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor Packaging
- 1 December 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (4) , 473-479
- https://doi.org/10.1109/tchmt.1983.1136207
Abstract
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