Thermal packaging of piggyback VCSELs for GBd optical communications modules

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Abstract
Agilent Laboratories, in a DARPA supported effort, has been developing a series of low-cost VCSEL based, high- performance, surface mount, parallel channel optical communications modules. Separate transmit and receive modules with 12 channels operating at 1.25 and 2.5 GBd per channel have been demonstrated with a datacom application target. Current designs have Vertical Cavity Surface Emitting Lasers (VCSELs) located in tandem with a driver IC on a copper base, which performs both a mechanical and thermal function. A flex circuit substrate laminated on the base provides signal interconnects. As channel speeds increase, the need for co-locating the VCSEL array and its associated output drivers to minimize inductance becomes more important. One solution is to piggyback the VCSELs on the transmitter IC. However, the design is constrained by the need to maintain the VCSEL junction temperature at an acceptable level. Finite element thermal modeling of the tandem mounted and piggybacked VCSELs are discussed, with a focus on comparison of the two schemes at current and projected future power levels, the effect of wirebonds on IC to VCSEL heat transfer, and performance issues related to temperature. Thermal imaging data are used to validate models. The overall module packaging scheme is also discussed.

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