Substrate integrated transition between a planar millimetre wave antenna and hermetically sealed integrated circuits

9 December 1993

journal article
Published by Institution of Engineering and Technology (IET) in Electronics Letters

Vol. 29 (25) , 2205-2206
https://doi.org/10.1049/el:19931481

Abstract

A novel fully planar transition between two microstrip lines with side changed metallisation patterns is presented. This transition is suited to connecting a planar antenna to hermetically sealed integrated circuits. The measured return loss between 36 and 40 GHz was 20dB. A broader operating bandwidth can be expected.

Keywords

SUBSTRATE INTEGRATED TRANSITION
MCMS
SIDE CHANGED METALLISATION PATTERNS
OPERATING BANDWIDTH
PLANAR MILLIMETRE WAVE ANTENNA
RETURN LOSS
MICROSTRIP LINES
20 DB
HERMETICALLY SEALED INTEGRATED CIRCUITS
36 TO 40 GHZ

This publication has 0 references indexed in Scilit: