Annealing Anodic Ta[sub 2]O[sub 5] Films Changes in Dissolution Behavior and X-Ray Scattering

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Abstract
Upon annealing anodic films the rate of solution of the film in decreases and the x‐ray diffraction pattern from the film becomes sharper. The activation energy for the process responsible for changes in solution rate is approximately the same as those observed for changes in ionic conduction upon annealing and for ionic conduction itself. It is believed that changes in local ionic configuration are the cause of these property changes. The rate at which these changes occur appears to be controlled by the rate of tantalumion motion.

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