New low coefficient of thermal expansion polyimide for inorganic substrates
- 13 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 155-159
- https://doi.org/10.1109/ecc.1989.77742
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Chemical structures and properties of low thermal expansion coefficient polyimidesPolymer Engineering & Science, 1988