Modeling and mixed signal simulation of embedded passive components in high performance packages

27 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 506-511
https://doi.org/10.1109/icmcm.1998.670832

Abstract

This paper discusses two approaches for mixed signal simulation in SPICE: (1) use of RF design kits; and (2) macromodeling. RF design kits enable synchronization of physical layouts, schematics, and electrical models, in a LIBRA design environment that provide SPICE compatibility through equivalent circuits. Macromodeling, however, provides a high level representation of the passive components or circuits and enables compatibility with SPICE and full electromagnetic simulators. Macromodels could then be used to build scalable models for the design kit. Both methods are examined using embedded capacitors and resistors fabricated using low temperature cofired ceramic technology. Simulations are compared to time domain measurements.

Keywords

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