Resists and Other Critical Issues in 157-nm Lithography.

Abstract
This paper outlines the critical issues facing the implementation of 157-nm lithography as a sub-100-nm technology. Special emphasis is placed on 157-nm photoresist options, including ultrathin resists and thicker resists with new chemistries. The status of other issues is also presented, such as mask materials, pellicles, optical materials, and coatings.

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