TiN-encapsulized copper interconnects for ULSI applications
- 13 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Diffusion of Metals in Silicon DioxideJournal of the Electrochemical Society, 1986
- Diffusion of copper in thin TiN filmsThin Solid Films, 1982