Horizontal Die Cracking as a Yield and Reliability Problem in Integrated Circuit Devices
- 1 December 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (4) , 654-661
- https://doi.org/10.1109/tchmt.1987.1134789
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Die Attach in Hi-Rel P-Dips: Polyimides or low chloride Epoxies?IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-CrackingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Brittle fracture: Its study and applicationContemporary Physics, 1971
- Thermal stress and fracture in shear-constrained semiconductor device structuresIRE Transactions on Electron Devices, 1962
- Thermally-induced cracking in the fabrication of semiconductor devicesIRE Transactions on Electron Devices, 1959