Plasma immersion Pd ion implantation seeding pattern formation for selective electroless Cu plating
- 1 April 1991
- journal article
- Published by Elsevier in Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
- Vol. 55 (1-4) , 888-892
- https://doi.org/10.1016/0168-583x(91)96301-z
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Selective electroless copper for VLSI interconnectionIEEE Electron Device Letters, 1989
- Plasma immersion ion implantation using plasmas generated by radio frequency techniquesApplied Physics Letters, 1988
- Plasma source ion-implantation technique for surface modification of materialsJournal of Applied Physics, 1987