Effect of copper lamination on the rheological and copper adhesion properties of a thermotropic liquid crystalline polymer used in PCB applications
- 1 July 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C
- Vol. 20 (3) , 219-226
- https://doi.org/10.1109/3476.649445
Abstract
No abstract availableKeywords
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