A new apparatus to measure the thermal conductivity and diffusivity of thermoplastic and thermosetting polymers

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Abstract
A new apparatus has been constructed to measure the thermal conductivity and the thermal diffusivity of reactive and nonreactive liquids and solids. The method used consists in suddenly subjecting the test specimen to a thermal flux and measuring the velocity of the heat wave across the sample. Maintaining the heat flux leads to a steady thermal gradient across the sample from which the thermal conductivity can be determined. The test duration is short relative to durations employed by existing conventional techniques and thus causes only a small thermal disturbance to the sample of the order of 1 to 2°C. Thermal properties of liquids and solids, including thermoplastics and a typical epoxy resin during cure with different equivalents of an aromatic diamine hardener have been measured near room temperature. Experimental data compare favorably with literature values for similar systems. Variations in thermal conductivity and diffusivity during cure have been obtained through a series of individual discrete measurements to cover the whole isothermal cure history. The results have been analyzed and discussed with respect to the cure characteristics of the resin and the nature of the physicochemical changes the material undergoes during cure.