Chip Scale Package (CSP) solder joint reliability and modeling
- 1 April 1999
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 39 (4) , 463-477
- https://doi.org/10.1016/s0026-2714(99)00017-7
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated TemperaturesJournal of Engineering Materials and Technology, 1982
- Laws for Work-Hardening and Low-Temperature CreepJournal of Engineering Materials and Technology, 1976