Dendritic Formation and the Effects of Addition Agents in the Electrodeposition of Copper from Acid Sulphate Solutions

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Abstract
Work reported earlier1 for dilute sulphate solutions has been extended to a more concentrated value (0·7M CuSO4 containing 1·5M H2SO4) and the effects of thiourea and benzotriazole addition agents examined in conditions of turbulent motion. The incidence of powdery or dendritic deposits has been related to a transition from charge transfer to mass transfer control of electrodeposition, which for copper is thought to take place at currents of about 0·4 IL. IL is the limiting current density. However, in practice when thin finite deposits are examined the transition may appear at greater values, for instance 0·7 IL. The mass transfer behaviour remains essentially the same at all conditions of turbulent electrodeposition.