Reliable submicron vias using aluminum alloy high temperature sputter filling
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- A new reliability problem associated with Ar ion sputter cleaning of interconnect viasPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- The properties of aluminum thin films sputter deposited at elevated temperaturesJournal of Vacuum Science & Technology A, 1988