The influence of base metal grain size on isothermal solidification during transient liquid-phase brazing of nickel
- 1 December 1993
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science
- Vol. 28 (23) , 6427-6432
- https://doi.org/10.1007/bf01352207
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Liquid- solid interface migration at grain boundary regions during transient liquid phase brazingMetallurgical Transactions A, 1992
- Microstructural development in transient liquid-phase bondingMetallurgical Transactions A, 1991
- Effect of grain boundaries on isothermal solidification during transient liquid phase brazingMetallurgical Transactions A, 1991
- Modeling of base metal dissolution behavior during transient liquid-phase brazingMetallurgical Transactions A, 1991
- Study on transient liquid insert metal diffusion bonding of Ni-base superalloys. (Part 2). Analysis of isothermal solidification process on transient liquid insert metal diffusion bonding.QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 1989