Improvement in Thermal Properties of a Multi-Beam Laser Diode Array
- 1 January 1989
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 28 (S3)
- https://doi.org/10.7567/jjaps.28s3.165
Abstract
Improvement in thermal performance of a high-density laser diode array including mutual thermal interactions is examined. Three-dimensional thermal analysis of a 50-µm-spaced 5-beam junction-down mounted laser diode array is performed on a practically scaled model, using the Boundary Element Method. The thermally dominant components are the chip and submount. The dominant heat flow route is also shown. A new structure is proposed that combines a high thermal conductive submount, a thin cap layer, and a heat-pass-wire, which acts as a bypass. This structure can almost halve the overall thermal resistance of conventionally structured laser arrays for 5-beam operations.Keywords
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