Dielectric breakdown strength affected by the lamellar configuration in XLPE insulation at a semiconducting interface
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electrical Insulation
- Vol. 24 (4) , 599-607
- https://doi.org/10.1109/14.34194
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- TEM observation of electrical tree paths and micro-structures in polyethylenePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Simultaneous Measurement of Microscopic Image and Discharge Pulses at the Moment of Electrical Tree InitiationJapanese Journal of Applied Physics, 1988