Grain Boundary Resistivity and Electrically Induced Grain Boundary Migration (EIGM) in Metallic Bamboo Microstructures
- 1 January 1999
- journal article
- Published by Springer Nature in Interface Science
- Vol. 7 (1) , 33-44
- https://doi.org/10.1023/a:1008778113938
Abstract
No abstract availableKeywords
This publication has 0 references indexed in Scilit: