On the origin of the dislocation substructure during high-temperature creep
- 1 March 1970
- journal article
- research article
- Published by Taylor & Francis in Philosophical Magazine
- Vol. 21 (171) , 509-518
- https://doi.org/10.1080/14786437008238435
Abstract
On the surface of a single-slip oriented copper crystal, slip and deformation bands, along with the thermally etched deformation substructure, could be observed after high-temperature creep. The substructure was further investigated in the transmission electron microscope. It has been proved that under given creep conditions the subgrain boundaries are formed predominantly in the plane normal to the slip direction and in the primary slip plane. The suggested conception of substructure formation has been based on the activity and interaction of several slip systems.Keywords
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