The effect of stress on grain boundary grooving
- 1 December 1993
- journal article
- Published by Elsevier in Acta Metallurgica et Materialia
- Vol. 41 (12) , 3541-3547
- https://doi.org/10.1016/0956-7151(93)90234-j
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Stress and electromigration in Al-lines of integrated circuitsPublished by Elsevier ,2003
- Capillary instabilities in thin films: A model of thermal pitting at grain boundary verticesActa Metallurgica et Materialia, 1992
- Diffusion-accommodated sliding of irregularly shaped grain boundariesJournal of Materials Research, 1990
- Voiding due to thermal stress in narrow conductor linesScripta Metallurgica, 1989
- Capillary instabilities in thin films. II. KineticsJournal of Applied Physics, 1986
- A second report on sintering diagramsActa Metallurgica, 1981
- Overview no. 2: Non-equilibrium models for diffusive cavitation of grain interfacesActa Metallurgica, 1979
- Diffusional creep and diffusionally accommodated grain rearrangementActa Metallurgica, 1978
- Stress generation by electromigrationApplied Physics Letters, 1976
- Theory of Thermal GroovingJournal of Applied Physics, 1957