Influence of Two‐Level Planar Interconnection Processes Using Bias‐Sputtered SiO2 for MOSFETs
- 1 September 1989
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 136 (9) , 2632-2637
- https://doi.org/10.1149/1.2097527