Effect of strain rate on solder joint failure under mechanical load
- 25 June 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 05695503,p. 974-978
- https://doi.org/10.1109/ectc.2002.1008219
Abstract
A four-point bend test fixture and a daisy-chained test coupon with BGA mounted at 45-degree orientation were developed to evaluate solder joint failure through a simple test and finite element modeling procedure. The bending test was performed under various loading speed. The BGAs tested have 1.27 mm and 1.00 mm pitches, respectively. One of the significant findings is that the solder joints failure is highly strain rate dependent. At higher strain rate, solder joint failed at much less board deflection for some BGAs. This indicates that the common practice of quasi-static bending test is not sufficient to quantify the solder joint failure under shock load.Keywords
This publication has 1 reference indexed in Scilit:
- Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder AlloyJournal of Electronic Packaging, 1999