Vertical Inline SAW Package (VISP)

• 1 January 1983
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• p. 125-128
• https://doi.org/10.1109/ultsym.1983.198028

Abstract

Keywords

• SURFACE ACOUSTIC WAVES
• PACKAGING
• COSTS
• SURFACE ACOUSTIC WAVE DEVICES
• DIELECTRIC SUBSTRATES
• FABRICATION
• BONDING
• CERAMICS
• PRINTED CIRCUITS
• CIRCUIT OPTIMIZATION